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  technical data sheet 334-15/t2c1-1sub everlight electronics co., ltd. http\\: www.everlight.com rev 1 page: 1 o f 9 device number: dle-0000318 established date:11-14-2008 estab lished by: ruby lin features ? popular t-1 3/4 round package ? high luminous power. ? typical chromaticity coordinates x=0.29, y=0.28 according to cie1931. ? bulk, available taped on reel. ? pb free . ? esd-withstand voltage: up to 4kv ? the product itself will remain within rohs complian t version . descriptions ? the series is designed for application required high luminous intensity. ? the phosphor filled in the reflector converts the blue emission of ingan chip to ideal white. applications ? outdoor displays ? optical indicators ? backlighting ? marker lights device selection guide part no. chip lens color material emitted color 334-15/t2c1-1sub ingan white water clear
technical data sheet 334-15/t2c1-1sub everlight electronics co., ltd. http\\: www.everlight.com rev 1 page: 2 o f 9 device number: dle-0000318 established date:11-14-2008 estab lished by: ruby lin package dimensions notes: 1.all dimensions are in millimeters, and tolerance is 0.25mm except being specified. 2.lead spacing is measured where the lead emerges f rom the package. 3.protruded resin under flange is 1.5mm max. led.
technical data sheet 334-15/t2c1-1sub everlight electronics co., ltd. http\\: www.everlight.com rev 1 page: 3 o f 9 device number: dle-0000318 established date:11-14-2008 estab lished by: ruby lin absolute maximum ratings (ta=25 ) parameter symbol rating unit continuous forward current i f 30 ma peak forward current(duty /10 @ 1khz) i fp 100 ma reverse voltage v r 5 v operating temperature t opr -40 ~ +85 storage temperature t stg -40 ~ +100 soldering temperature (t=5 sec) t sol 260 power dissipation p d 100 mw zener reverse current iz 100 ma electrostatic discharge esd 4k v
technical data sheet 334-15/t2c1-1sub everlight electronics co., ltd. http\\: www.everlight.com rev 1 page: 4 o f 9 device number: dle-0000318 established date:11-14-2008 estab lished by: ruby lin production designation 334-15/t2c1- electro-optical characteristics (ta=25 ) parameter symbol condition min. typ. max. units forward voltage v f i f =20ma 2.8 -- 3.6 v zener reverse voltage vz iz=5ma 5.2 ---- ----- v reverse current i r v r =5v -- -- 50 ua luminous intensity i v i f =20ma 5650 11250 mcd viewing angle 2 1/2 i f =20ma -- 15 -- deg chromaticity coordinates x i f =20ma -- 0.29 -- -- y -- 0.28 -- -- color group luminous intensity bins voltage group
technical data sheet 334-15/t2c1-1sub everlight electronics co., ltd. http\\: www.everlight.com rev 1 page: 5 o f 9 device number: dle-0000318 established date:11-14-2008 estab lished by: ruby lin luminous intensity combination ( mcd at 20ma) *measurement uncertainty of luminous intensity: 10% forward voltage combination ( v at 20ma) rank 0 1 2 3 forward voltage 2.8~3.0 3.0~3.2 3.2~3.4 3.4~3.6 *measurement uncertainty of forward voltage 0.1v color combination ( at 20ma) group bins 1 a1+a0+b3+b4+b5+b6+c0 rank min max s 5650 7150 t 7150 9000 u 9000 11250
technical data sheet 334-15/t2c1-1sub everlight electronics co., ltd. http\\: www.everlight.com rev 1 page: 6 o f 9 device number: dle-0000318 established date:11-14-2008 estab lished by: ruby lin cie chromaticity diagram color ranks (if=20ma ta=25 ) color ranks cie a1 x 0.255 0.264 0.28 0.27 y 0.245 0.267 0.248 0.23 a0 x 0.264 0.283 0.296 0.28 y 0.267 0.305 0.267 0.248 b3 x 0.283 0.304 0.307 0.287 y 0.305 0.33 0.315 0.295 b4 x 0.304 0.33 0.33 0.307 y 0.33 0.36 0.339 0.315 b5 x 0.287 0.307 0.311 0.296 y 0.295 0.315 0.294 0.276 b6 x 0.307 0.33 0.33 0.311 y 0.315 0.339 0.318 0.294 c0 x 0.33 0.361 0.355 0.33 y 0.36 0.385 0.35 0.318 measurement uncertainty of the color coordinates 0.01 0 .0 0 .1 0 .2 0 .3 0 .4 0 .5 0.6 0 .7 0 .0 0 .2 0 .4 0 .6 0 .8 46 00k 56 00k 700 0k 9 00 0k 1 40 00 k 2 200 0k b 4 c o b 5 b 3 a o a 1 b 6 cie-y c ie -x
technical data sheet 334-15/t2c1-1sub everlight electronics co., ltd. http\\: www.everlight.com rev 1 page: 7 o f 9 device number: dle-0000318 established date:11-14-2008 estab lished by: ruby lin 0 20 40 60 80 100 0 10 20 30 40 forward current(ma) ambient temperature ta( o c) typical electro-optical characteristics curves relative intensity vs. wavelength forwar d current vs. forward voltage relative intensity vs. forward current for ward current vs. ambient temp. chromaticity coordinate vs. forward current rel ative intensity vs. angle displacement 2.0 2.5 3.0 3.5 4.0 4.5 0 5 10 15 20 25 forward current(ma) forward voltage(v) 0 10 20 30 40 50 0.260 0.270 0.280 0.290 0.300 relative intensity(a.u.) forward current(ma) x y 350 400 450 500 550 600 650 700 750 800 0.0 0.2 0.4 0.6 0.8 1.0 relative intensity(a.u.) wavelength(nm) 0 5 10 15 20 25 0.0 0.5 1.0 1.5 relative intensity(a.u.) forward current(ma) 0 10 20 30 40 50 60 70 80 90 o o o o o o o o o o 0 1.0 1.0 0.5 30 o 60 o 90 o 0 0.5 relative luminusity radiation angle
technical data sheet 334-15/t2c1-1sub everlight electronics co., ltd. http\\: www.everlight.com rev 1 page: 8 o f 9 device number: dle-0000318 established date:11-14-2008 estab lished by: ruby lin pb el ectrostatic electronagnetic magnetic or radioactive relds anti-static for 750 label packing specification anti-electrostatic bag inner carton label form specification cpn: customer?s production number p/n : production number qty: packing quantity cat: ranks of luminous intensity and forward voltag e hue: color rank outside carton ref: reference lot no: lot number made in taiwan: production place packing quantity 1. 500 pcs/1 bag, 5 bags/1 inner carton 2. 10 inner cartons/1 outside carton
technical data sheet 334-15/t2c1-1sub everlight electronics co., ltd. http\\: www.everlight.com rev 1 page: 9 o f 9 device number: dle-0000318 established date:11-14-2008 estab lished by: ruby lin notes 1. lead forming  during lead formation, the leads should be bent at a point at least 3mm from the base of the epoxy bulb.  lead forming should be done before soldering.  avoid stressing the led package during leads formin g. the stress to the base may damage the led?s characteristics or it may break the leds.  cut the led leadframes at room temperature. cutting the leadframes at high temperatures may cause failure of the leds.  when mounting the leds onto a pcb, the pcb holes mu st be aligned exactly with the lead position of the led. if the leds are mounted with s tress at the leads, it causes deterioration of the epoxy resin and this will degrade the leds. 2. storage  the leds should be stored at 30c or less and 70%rh or less after being shipped from everlight and the storage life limits are 3 months. if the leds are stored for 3 months or more, they can be stored for a year in a sealed container with a nitrogen atmosphere and moisture absorbent material.  please avoid rapid transitions in ambient temperatu re, especially, in high humidity environments where condensation can occur. 3. soldering  careful attention should be paid during soldering. when soldering, leave more then 3mm from solder joint to epoxy bulb, and soldering beyond th e base of the tie bar is recommended.  recommended soldering conditions: hand soldering dip soldering temp. at tip of iron 300 max. (30w max.) preheat temp. 100 max. (60 sec max.) soldering time 3 sec max. bath temp. & time 260 max., 5 sec max distance 3mm min.(from solder joint to epoxy bulb) distance 3mm min. (from solder joint to epoxy bulb)
technical data sheet 334-15/t2c1-1sub everlight electronics co., ltd. http\\: www.everlight.com rev 1 page: 10 of 9 device number: dle-0000318 established date:11-14-2008 estab lished by: ruby lin prehead laminar wave fluxing  avoiding applying any stress to the lead frame whil e the leds are at high temperature particularly when soldering.  dip and hand soldering should not be done more than one time  after soldering the leds, the epoxy bulb should be protected from mechanical shock or vibration until the leds return to room temperature .  a rapid-rate process is not recommended for cooling the leds down from the peak temperature.  although the recommended soldering conditions are s pecified in the above table, dip or handsoldering at the lowest possible temperature is desirable for the leds.  wave soldering parameter must be set and maintain a ccording to recommended temperature and dwell time in the solder wave. 4. cleaning  when necessary, cleaning should occur only with iso propyl alcohol at room temperature for a duration of no more than one minute. dry at room te mperature before use.  do not clean the leds by the ultrasonic. when it is absolutely necessary, the influence of ultrasonic cleaning on the leds depends on factors such as ultrasonic power and the assembled condition. ultrasonic cleaning shall be pre-qualifi ed to ensure this will not cause damage to the led
technical data sheet 334-15/t2c1-1sub everlight electronics co., ltd. http\\: www.everlight.com rev 1 page: 11 of 9 device number: dle-0000318 established date:11-14-2008 estab lished by: ruby lin 5. circuit protection  below the zener reference voltage vz, all the curre nt flows through led and as the voltage rises to vz, the zener diode ?breakdown." if the voltage tries to rise above vz current flows through the zener branch to keep the voltage at exactly vz.  when the led is connected using serial circuit, if either piece of led is no light up but current can?t flow through causing others to light down. in new design, the led is parallel with zener diode. if either piece of led is no light up but cu rrent can flow through causing others to light up. 6. heat management  heat management of leds must be taken into consider ation during the design stage of led application. the current should be de-rated appropr iately by referring to the de-rating curve found in each product specification.  the temperature surrounding the led in the applicat ion should be controlled. please refer to the data sheet de-rating curve.
technical data sheet 334-15/t2c1-1sub everlight electronics co., ltd. http\\: www.everlight.com rev 1 page: 12 of 9 device number: dle-0000318 established date:11-14-2008 estab lished by: ruby lin 7. esd (electrostatic discharge)  electrostatic discharge (esd) or surge current (eos ) can damage leds.  an esd wrist strap, esd shoe strap or antistatic gl oves must be worn whenever handling leds.  all devices, equipment and machinery must be proper ly grounded.  use ion blower to neutralize the static charge which might have built up on surface of the leds plastic le ns as a result of friction between leds during stor age and handing. 8. other  above specification may be changed without notice. everlight will reserve authority on material change for above specification.  when using this product, please observe the absolut e maximum ratings and the instructions for using outlined in these specification sheets. everl ight assumes no responsibility for any damage resulting from use of the product which does not comply with the absolute maximum ratings and the instructions included in these spec ification sheets.  these specification sheets include materials protec ted under copyright of everlight corporation. please don?t reproduce or cause anyone to reproduce them without everlight?s consent. everlight electronics co., ltd. tel: 886-2-2267-2000, 2267-9936 office: no 25, lane 76, sec 3, chung yang rd, f ax: 886-2267-6244, 2267-6189, 2267-6306 tucheng, taipei 236, taiwan, r.o.c http:\\ www.everlight.com


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